Ams OSRAM Launches Thin-Film VCSEL for AI Advancements

On September 21, 2026, ams OSRAM announced a breakthrough in Thin-Film VCSEL technology aimed at enhancing AI scale-up capabilities. The company introduced an 850nm Thin-Film microVCSEL array designed to optimize data movement within AI systems, addressing the need for higher bandwidths and improved energy efficiency.

In collaboration with BizLink, ams OSRAM showcased a connectorized multi-core fiber solution at ECOC 2026, targeting the challenges of data movement in AI infrastructure. This development highlights advances in optical interconnect technology, emphasizing the importance of power efficiency and scalability.

ams OSRAM's approach focuses on a "wide-and-slow" architecture, distributing data across multiple optical lanes to reduce latency and power consumption while promoting sustainable infrastructure expansion. Reliability testing has confirmed the technology's durability, bolstering its potential for future AI applications.