News
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COMMUNIQUÉ DE PRESSE
ROHM Launches New Top-side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support
ROHM launches TSC3PAK, a top-side cooling package for SiC MOSFETs. Enables automated mounting with high heat dissipation & voltage support for power conversion circuits in electric vehicles & industrial equipment -
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COMMUNIQUÉ DE PRESSE
ROHM's Scalable Power Supply Solutions for Automotive SoCs; Combining PMIC and DrMOS for Optimal SoC Power Design and Future Performance
ROHM Co., Ltd. unveils scalable power supply solutions combining PMIC and DrMOS for automotive SoCs, enhancing power efficiency and design flexibility -